Lenovo AD80582QH056003 Datasheet download pdf (Page 54)

Mechanical Specifications

54 Intel® Xeon® Processor 7400 Series Datasheet

3.2 Processor Component Keepout Zones

The processor may contain components on the substrate that define component

keepout zone requirements. A thermal and mechanical solution design must not intrude

into the required keepout zones. Decoupling capacitors are typically mounted to either

the topside or pin-side of the package substrate. All drawing dimension are in mm [in].

1 2 ... 49 50 51 52 53 54 55 56 57 58 59 ... 135 136

Datasheet 1
Contents 3
Revision History 7
1 Introduction 9
1.1 Terminology 11
Introduction 12
1.2 State of Data 13
1.3 References 13
2 Electrical Specifications 15
2.2 Decoupling Guidelines 16
Clocking 16
2.3.2 PLL Power Supply 18
Electrical Specifications 20
Table 2-4. FSB Signal Groups 21
Asynchronous Signals 22
2.9 Mixing Processors 23
Time Duration (s) 28
Sustained Current (A) 28
Table 2-10. V 30
Figure 2-4. V 31
2.11.2 V 33
Overshoot Specification 33
2.11.3 Die Voltage Validation 33
2.11.4.1 DC Characteristics 34
2.12 AGTL+ FSB Specifications 35
Tp = T1: BCLK[1:0] period 42
THERMTRIP# 46
System bus 48
FERR#/PBE# 48
Figure 2-22. VID Step Timings 49
3 Mechanical Specifications 51
Mechanical Specifications 52
3.7 Processor Materials 61
3.8 Processor Markings 62
Processor 63
4 Pin Listing 65
(Sheet 3 of 16) 66
(Sheet 4 of 16) 66
(Sheet 5 of 16) 67
(Sheet 6 of 16) 67
(Sheet 7 of 16) 68
(Sheet 8 of 16) 68
(Sheet 9 of 16) 69
(Sheet 10 of 16) 69
(Sheet 11 of 16) 70
(Sheet 12 of 16) 70
(Sheet 13 of 16) 71
(Sheet 14 of 16) 71
(Sheet 15 of 16) 72
(Sheet 16 of 16) 72
(Sheet 1 of 14) 73
(Sheet 2 of 14) 73
(Sheet 3 of 14) 74
(Sheet 4 of 14) 74
(Sheet 5 of 14) 75
(Sheet 6 of 14) 75
(Sheet 7 of 14) 76
(Sheet 8 of 14) 76
(Sheet 9 of 14) 77
(Sheet 10 of 14) 77
(Sheet 11 of 14) 78
(Sheet 12 of 14) 78
(Sheet 13 of 14) 79
(Sheet 14 of 14) 79
Pin Listing 80
5 Signal Definitions 81
FSB agents 85
. The processor includes 86
6 Thermal Specifications 89
CASE_MAX 90
CASE (°C) 91
= 0.431 x Power + 45 95
Power (W) 96
Temperature (C) 96
6.1.2 Thermal Metrology 97
6.2.2 Intel Thermal Monitor 97
6.2.3 Intel Thermal Monitor 2 98
6.2.4 On-Demand Mode 99
6.2.5 PROCHOT# Signal 100
6.2.6 FORCEPR# Signal 100
6.2.7 THERMTRIP# Signal 100
6.3.1 Introduction 101
6.3.1.1 T 102
6.3.2.1 PECI Device Address 103
6.3.2.2 PECI Command Support 103
7 Features 105
7.2.2.1 HALT State 106
7.2.2.2 Extended HALT State 106
7.2.3 Stop-Grant State 108
7.3 Enhanced Intel SpeedStep 109
Technology 109
Features 110
7.4.1 SMBus Device Addressing 111
Transactions 112
7.4.3.1 Header 115
7.4.3.2 Processor Data 119
0Eh-13h 120
7.4.3.3 Processor Core Data 121
Offset: 1Ah-1Bh 122
7.4.3.4 Cache Data 124
Offset: 29h-2Ah 125
2Bh-2Ch 125
2Dh-2Eh 125
7.4.3.5 Package Data 126
7.4.3.6 Part Number Data 127
38h-3Eh 128
3Fh-4Ch 128
4Dh=54h 128
55h-6Eh 128
71h-72h 129
7.4.3.8 Feature Data 130
7.4.3.9 OD: Other Data 131
7.4.4 Checksums 132
7.4.5 Scratch EEPROM 132
8 Debug Tools Specifications 133
Debug Tools Specifications 134
9.1 Introduction 135
9.2 Thermal Specifications 135

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Lenovo AD80582QH056003 Datasheet Page 54

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