Lenovo LF80565QH0254M Datasheet Page 21
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Document Number: 318080-002 21
Electrical Specifications
Notes:
1. Refer to Section 5 for signal descriptions.
2. These signals may be driven simultaneously by multiple agents (Wired-OR).
Table 2-4. FSB Signal Groups
Signal Group Type Signals
1
AGTL+ Common Clock Input Synchronous to BCLK[1:0] BPRI#, DEFER#, RESET#, RS[2:0]#, RSP#,
TRDY#;
AGTL+ Common Clock Output Synchronous to BCLK[1:0] BPM4#, BPM[2:1]#, BPMb[2:1]#
AGTL+ Common Clock I/O Synchronous to BCLK[1:0] ADS#, AP[1:0]#, BINIT#
2
, BNR#
2
, BPM5#,
BPM3#, BPM0#, BPMb3#, BPMb0#,
BR[1:0]#, DBSY#, DP[3:0]#, DRDY#, HIT#
2
,
HITM#
2
, LOCK#, MCERR#
2
AGTL+ Source Synchronous
I/O
Synchronous to assoc.
strobe
AGTL+ Strobes I/O Synchronous to BCLK[1:0] ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]#
Open Drain Output Asynchronous FERR#/PBE#, IERR#, PROCHOT#,
THERMTRIP#, TDO
CMOS Asynchronous Input Asynchronous A20M#, FORCEPR#, IGNNE#, INIT#,
LINT0/INTR, LINT1/NMI, PWRGOOD, SMI#,
STPCLK#, TCK, TDI, TMS TRST#
CMOS Asynchronous Output Asynchronous BSEL[2:0], VID[6:1]
FSB Clock Clock BCLK[1:0]
SMBus Synchronous to SM_CLK SM_CLK, SM_DAT, SM_EP_A[2:0], SM_WP
Power/Other Power/Other COMP[3:0], GTLREF_ADD_MID,
GTLREF_ADD_END, GTLREF_DATA_MID,
GTLREF_DATA_END, LL_ID[1:0],
PROC_ID[1:0], PECI, RESERVED,
SKTOCC#,SM_VCC, TESTHI[1:0], TESTIN1,
TESTIN2, VCC, VCC_SENSE, VCC_SENSE2,
VCCPLL, VSS_SENSE, VSS_SENSE2, VSS,
VTT, VTT_SEL
Signals Associated Strobe
REQ[4:0]#
A[37:36,16:3]#
ADSTB0#
A[39:38, 35:17]# ADSTB1#
D[15:0]#, DBI0# DSTBP0#, DSTBN0#
D[31:16]#, DBI1# DSTBP1#, DSTBN1#
D[47:32]#, DBI2# DSTBP2#, DSTBN2#
D[63:48]#, DBI3# DSTBP3#, DSTBN3#
- Processor 7200 Series 1
- Contents 3
- 4 Document Number: 318080-002 4
- Document Number: 318080-002 5 5
- 6 Document Number: 318080-002 6
- Document Number: 318080-002 7 7
- Revision History 8
- 1 Introduction 9
- 1.1 Terminology 11
- Introduction 12
- 1.2 State of Data 13
- 1.3 References 13
- 2 Electrical Specifications 15
- Clocking 16
- 2.3.2 PLL Power Supply 17
- Electrical Specifications 18
- Table 2-4. FSB Signal Groups 21
- Asynchronous Signals 22
- 2.9 Mixing Processors 23
- CC_VTT_OUT 27
- Time Duration (s) 28
- Sustained Current (A) 28
- Table 2-10. V 30
- Load Lines 32
- Static and Transient 34
- Tolerance Load Lines 34
- Specifications 35
- 2.11.2.1 DC Characteristics 36
- 2.11.3 V 37
- Overshoot Specification 37
- Example Overshoot Waveform 38
- Tp = T1: BCLK[1:0] period 47
- THERMTRIP# 51
- Figure 2-26. VID Step Timings 54
- 3 Mechanical Specifications 57
- Mechanical Specifications 58
- 3.7 Processor Materials 67
- 3.8 Processor Markings 68
- Processor 69
- 4 Pin Listing 71
- 10 of 16) 75
- 11 of 16) 76
- 12 of 16) 76
- 13 of 16) 77
- 14 of 16) 77
- 15 of 16) 78
- 16 of 16) 78
- 1 of 14) 79
- 2 of 14) 79
- 3 of 14) 80
- 4 of 14) 80
- 5 of 14) 81
- 6 of 14) 81
- 8 of 14) 82
- 7 of 14) 82
- 9 of 14) 83
- 10 of 14) 83
- 11 of 14) 84
- 12 of 14) 84
- 13 of 14) 85
- 14 of 14) 85
- Pin Listing 86
- 5 Signal Definitions 87
- CC and BCLK have reached 92
- 6 Thermal Specifications 95
- CASE_MAX 96
- Thermal Profile 98
- = 0.162 x Power + 45 98
- Pow er (W) 100
- Temperature (C) 100
- = 0.420 x Power + 45 100
- = 0.238 x Power + 45 101
- 6.1.2 Thermal Metrology 102
- 6.2.2 Thermal Monitor 103
- 6.2.3 Thermal Monitor 2 104
- 6.2.4 On-Demand Mode 105
- 6.2.5 PROCHOT# Signal 106
- 6.2.6 FORCEPR# Signal 106
- 6.2.7 THERMTRIP# Signal 106
- 6.3.1 Introduction 107
- 6.3.2 PECI Specifications 108
- 7 Features 111
- 7.2.1 Normal State 112
- EXTENDED_HALT 113
- 7.2.3 Stop-Grant State 114
- 7.3 Enhanced Intel SpeedStep 115
- Technology 115
- Features 116
- 7.4.1 SMBus Device Addressing 117
- Transactions 118
- 7.4.3.1 Header 121
- 7.4.3.2 Processor Data 125
- 7.4.3.3 Processor Core Data 126
- 16h-19h 127
- 1Ah-1Bh 127
- Offset: 1Ch 128
- 1Dh-1Eh 128
- 1Fh-20h 128
- 7.4.3.4 Cache Data 129
- 7.4.3.5 Package Data 131
- 7.4.3.6 Part Number Data 132
- 38h-3Eh 133
- 3Fh-4Ch 133
- 4Dh=54h 133
- 55h-6Eh 134
- 71h-72h 134
- 7.4.3.8 Feature Data 135
- 7.4.3.9 Other Data 136
- 7.4.4 Checksums 137
- 7.4.5 Scratch EEPROM 137
- 8.1 Introduction 139
- 8.2 Thermal Specifications 139
- 9 Debug Tools Specifications 141
- Debug Tools Specifications 142
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