Lenovo LF80565QH0254M Datasheet Page 68
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Mechanical Specifications
68 Document Number: 318080-002
3.8 Processor Markings
Figure 3-9 shows the topside markings and Figure 3-10 shows the bottom-side
markings on the processor. These diagrams are to aid in the identification of the Intel
®
Xeon
®
Processor 7200 Series and 7300 Series. Please note that the figures in this
section are not to scale.
Notes:
1. Character size for laser markings is: 17 Point, height 1.27 mm (50 mils), width 0.81 mm (32 mils)
2. All characters will be in upper case.
Notes:
1. Character size for laser markings is: 21 Point, height 1.43 mm (56 mils), width 0.95 mm (37.5 mils)
Figure 3-9. Processor Topside Markings
INTEL® XEON®
i{M}©’YY {PbFree symbol}
2D Matrix
FPO – Serial #
Pin 1 Indicator
INTEL® XEON®
i{M}©’YY {PbFree symbol}
2D Matrix
FPO – Serial #
Pin 1 Indicator
Figure 3-10. Processor Bottom-Side Markings
X7350 2933MP/8M/1066
SLA67 COSTA RICA
C0096109-0021
Processor/Speed/Cache/Bus
Number
S-Spec
Country of Assy
FPO – Serial #
(13 Characters)
Pin Field
Cavity
with
Components
Text Line1
Text Line2
Text Line3
Pin 1 Indicator
2D Matrix
FPO – Serial #
X7350 2933MP/8M/1066
SLA67 COSTA RICA
C0096109-0021
Processor/Speed/Cache/Bus
Number
S-Spec
Country of Assy
FPO – Serial #
(13 Characters)
Pin Field
Cavity
with
Components
Text Line1
Text Line2
Text Line3
Pin 1 Indicator
2D Matrix
FPO – Serial #
- Processor 7200 Series 1
- Contents 3
- 4 Document Number: 318080-002 4
- Document Number: 318080-002 5 5
- 6 Document Number: 318080-002 6
- Document Number: 318080-002 7 7
- Revision History 8
- 1 Introduction 9
- 1.1 Terminology 11
- Introduction 12
- 1.2 State of Data 13
- 1.3 References 13
- 2 Electrical Specifications 15
- Clocking 16
- 2.3.2 PLL Power Supply 17
- Electrical Specifications 18
- Table 2-4. FSB Signal Groups 21
- Asynchronous Signals 22
- 2.9 Mixing Processors 23
- CC_VTT_OUT 27
- Time Duration (s) 28
- Sustained Current (A) 28
- Table 2-10. V 30
- Load Lines 32
- Static and Transient 34
- Tolerance Load Lines 34
- Specifications 35
- 2.11.2.1 DC Characteristics 36
- 2.11.3 V 37
- Overshoot Specification 37
- Example Overshoot Waveform 38
- Tp = T1: BCLK[1:0] period 47
- THERMTRIP# 51
- Figure 2-26. VID Step Timings 54
- 3 Mechanical Specifications 57
- Mechanical Specifications 58
- 3.7 Processor Materials 67
- 3.8 Processor Markings 68
- Processor 69
- 4 Pin Listing 71
- 10 of 16) 75
- 11 of 16) 76
- 12 of 16) 76
- 13 of 16) 77
- 14 of 16) 77
- 15 of 16) 78
- 16 of 16) 78
- 1 of 14) 79
- 2 of 14) 79
- 3 of 14) 80
- 4 of 14) 80
- 5 of 14) 81
- 6 of 14) 81
- 8 of 14) 82
- 7 of 14) 82
- 9 of 14) 83
- 10 of 14) 83
- 11 of 14) 84
- 12 of 14) 84
- 13 of 14) 85
- 14 of 14) 85
- Pin Listing 86
- 5 Signal Definitions 87
- CC and BCLK have reached 92
- 6 Thermal Specifications 95
- CASE_MAX 96
- Thermal Profile 98
- = 0.162 x Power + 45 98
- Pow er (W) 100
- Temperature (C) 100
- = 0.420 x Power + 45 100
- = 0.238 x Power + 45 101
- 6.1.2 Thermal Metrology 102
- 6.2.2 Thermal Monitor 103
- 6.2.3 Thermal Monitor 2 104
- 6.2.4 On-Demand Mode 105
- 6.2.5 PROCHOT# Signal 106
- 6.2.6 FORCEPR# Signal 106
- 6.2.7 THERMTRIP# Signal 106
- 6.3.1 Introduction 107
- 6.3.2 PECI Specifications 108
- 7 Features 111
- 7.2.1 Normal State 112
- EXTENDED_HALT 113
- 7.2.3 Stop-Grant State 114
- 7.3 Enhanced Intel SpeedStep 115
- Technology 115
- Features 116
- 7.4.1 SMBus Device Addressing 117
- Transactions 118
- 7.4.3.1 Header 121
- 7.4.3.2 Processor Data 125
- 7.4.3.3 Processor Core Data 126
- 16h-19h 127
- 1Ah-1Bh 127
- Offset: 1Ch 128
- 1Dh-1Eh 128
- 1Fh-20h 128
- 7.4.3.4 Cache Data 129
- 7.4.3.5 Package Data 131
- 7.4.3.6 Part Number Data 132
- 38h-3Eh 133
- 3Fh-4Ch 133
- 4Dh=54h 133
- 55h-6Eh 134
- 71h-72h 134
- 7.4.3.8 Feature Data 135
- 7.4.3.9 Other Data 136
- 7.4.4 Checksums 137
- 7.4.5 Scratch EEPROM 137
- 8.1 Introduction 139
- 8.2 Thermal Specifications 139
- 9 Debug Tools Specifications 141
- Debug Tools Specifications 142
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