Lenovo LF80565QH0254M Datasheet Page 93
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Document Number: 318080-002 93
Signal Definitions
SMI# I SMI# (System Management Interrupt) is asserted asynchronously by system logic.
On accepting a System Management Interrupt, processors save the current state and
enter System Management Mode (SMM). An SMI Acknowledge transaction is issued,
and the processor begins program execution from the SMM handler.
If SMI# is asserted during the deassertion of RESET# the processor will tri-state its
outputs. See Section 7.1.
STPCLK# I STPCLK# (Stop Clock), when asserted, causes processors to enter a low power Stop-
Grant state. The processor issues a Stop-Grant Acknowledge transaction, and stops
providing internal clock signals to all processor core units except the FSB and APIC
units. The processor continues to snoop bus transactions and service interrupts while
in Stop-Grant state. When STPCLK# is deasserted, the processor restarts its internal
clock to all units and resumes execution. The assertion of STPCLK# has no effect on
the bus clock; STPCLK# is an asynchronous input.
TCK I TCK (Test Clock) provides the clock input for the processor Test Bus (also known as
the Test Access Port).
TDI I TDI (Test Data In) transfers serial test data into the processor. TDI provides the serial
input needed for JTAG specification support.
TDO O TDO (Test Data Out) transfers serial test data out of the processor. TDO provides the
serial output needed for JTAG specification support.
TESTHI[1:0] I TESTHI[1:0] must be connected to a V
tt
power source through a resistor for proper
processor operation. Refer to Section 2.5 for TESTHI grouping restrictions.
TESTIN1
TESTIN2
I
I
TESTIN1 must be connected to a VTT power source through a resistor as well as to
the TESTIN2 pin of the same socket for proper processor operation.
TESTIN2 must be connected to a VTT power source through a resistor as well as to
the TESTIN1 pin of the same socket for proper processor operation.
Refer to Section 2.5 for TESTIN restrictions.
THERMTRIP# O Assertion of THERMTRIP# (Thermal Trip) indicates the processor junction
temperature has reached a temperature beyond which permanent silicon damage
may occur. Measurement of the temperature is accomplished through an internal
thermal sensor. Upon assertion of THERMTRIP#, the processor will shut off its internal
clocks (thus halting program execution) in an attempt to reduce the processor
junction temperature. To protect the processor, its core voltage (V
CC
) must be
removed following the assertion of THERMTRIP#. See Figure 2-21 and Table 2-22 for
the appropriate power down sequence and timing requirements. Intel also
recommends the removal of V
TT
when THERMTRIP# is asserted.
Driving of the THERMTRIP# signals is enabled within 10 μs of the assertion of
PWRGOOD and is disabled on de-assertion of PWRGOOD. Once activated,
THERMTRIP# remains latched until PWRGOOD is de-asserted. While the de-assertion
of the PWRGOOD signal will de-assert THERMTRIP#, if the processor’s junction
temperature remains at or above the trip level, THERMTRIP# will again be asserted
within 10 μs of the assertion of PWRGOOD.
TMS I TMS (Test Mode Select) is a JTAG specification support signal used by debug tools.
See the XDP: Debug Port Design Guide for Intel® 7300 Chipset Platforms for further
information.
TRDY# I TRDY# (Target Ready) is asserted by the target to indicate that it is ready to receive
a write or implicit writeback data transfer. TRDY# must connect the appropriate pins
of all FSB agents.
TRST# I TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST# must be driven
low during power on Reset.
V
CCPLL
IThe Intel
®
Xeon
®
Processor 7200 Series and 7300 Series implement an on-die PLL
filter solution. The V
CCPLL
input is used as a PLL supply voltage.
VCC_SENSE
VCC_SENSE2
O VCC_SENSE and VCC_SENSE2 provides an isolated, low impedance connection to the
processor core power and ground. These signals should be used to provide feedback
to the voltage regulator signals, which ensure the output voltage (that is, processor
voltage) remains within specification. Please see the applicable platform design guide
for implementation details.
Table 5-1. Signal Definitions (Sheet 7 of 8)
Name Type Description Notes
- Processor 7200 Series 1
- Contents 3
- 4 Document Number: 318080-002 4
- Document Number: 318080-002 5 5
- 6 Document Number: 318080-002 6
- Document Number: 318080-002 7 7
- Revision History 8
- 1 Introduction 9
- 1.1 Terminology 11
- Introduction 12
- 1.2 State of Data 13
- 1.3 References 13
- 2 Electrical Specifications 15
- Clocking 16
- 2.3.2 PLL Power Supply 17
- Electrical Specifications 18
- Table 2-4. FSB Signal Groups 21
- Asynchronous Signals 22
- 2.9 Mixing Processors 23
- CC_VTT_OUT 27
- Time Duration (s) 28
- Sustained Current (A) 28
- Table 2-10. V 30
- Load Lines 32
- Static and Transient 34
- Tolerance Load Lines 34
- Specifications 35
- 2.11.2.1 DC Characteristics 36
- 2.11.3 V 37
- Overshoot Specification 37
- Example Overshoot Waveform 38
- Tp = T1: BCLK[1:0] period 47
- THERMTRIP# 51
- Figure 2-26. VID Step Timings 54
- 3 Mechanical Specifications 57
- Mechanical Specifications 58
- 3.7 Processor Materials 67
- 3.8 Processor Markings 68
- Processor 69
- 4 Pin Listing 71
- 10 of 16) 75
- 11 of 16) 76
- 12 of 16) 76
- 13 of 16) 77
- 14 of 16) 77
- 15 of 16) 78
- 16 of 16) 78
- 1 of 14) 79
- 2 of 14) 79
- 3 of 14) 80
- 4 of 14) 80
- 5 of 14) 81
- 6 of 14) 81
- 8 of 14) 82
- 7 of 14) 82
- 9 of 14) 83
- 10 of 14) 83
- 11 of 14) 84
- 12 of 14) 84
- 13 of 14) 85
- 14 of 14) 85
- Pin Listing 86
- 5 Signal Definitions 87
- CC and BCLK have reached 92
- 6 Thermal Specifications 95
- CASE_MAX 96
- Thermal Profile 98
- = 0.162 x Power + 45 98
- Pow er (W) 100
- Temperature (C) 100
- = 0.420 x Power + 45 100
- = 0.238 x Power + 45 101
- 6.1.2 Thermal Metrology 102
- 6.2.2 Thermal Monitor 103
- 6.2.3 Thermal Monitor 2 104
- 6.2.4 On-Demand Mode 105
- 6.2.5 PROCHOT# Signal 106
- 6.2.6 FORCEPR# Signal 106
- 6.2.7 THERMTRIP# Signal 106
- 6.3.1 Introduction 107
- 6.3.2 PECI Specifications 108
- 7 Features 111
- 7.2.1 Normal State 112
- EXTENDED_HALT 113
- 7.2.3 Stop-Grant State 114
- 7.3 Enhanced Intel SpeedStep 115
- Technology 115
- Features 116
- 7.4.1 SMBus Device Addressing 117
- Transactions 118
- 7.4.3.1 Header 121
- 7.4.3.2 Processor Data 125
- 7.4.3.3 Processor Core Data 126
- 16h-19h 127
- 1Ah-1Bh 127
- Offset: 1Ch 128
- 1Dh-1Eh 128
- 1Fh-20h 128
- 7.4.3.4 Cache Data 129
- 7.4.3.5 Package Data 131
- 7.4.3.6 Part Number Data 132
- 38h-3Eh 133
- 3Fh-4Ch 133
- 4Dh=54h 133
- 55h-6Eh 134
- 71h-72h 134
- 7.4.3.8 Feature Data 135
- 7.4.3.9 Other Data 136
- 7.4.4 Checksums 137
- 7.4.5 Scratch EEPROM 137
- 8.1 Introduction 139
- 8.2 Thermal Specifications 139
- 9 Debug Tools Specifications 141
- Debug Tools Specifications 142
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