Lenovo 59P5107 Datasheet download pdf (Page 89)

Low Voltage Intel

Xeon

™

Processor at 1.60 GHz, 2.0 GHz and 2.4 GHz

Datasheet 89

6.0 Thermal Specifications

This chapter provides the thermal specifications necessary for designing a thermal solution for the

Low Voltage Intel

Xeon

™

processor. Thermal solutions should include heatsinks that apply

pressure to the integrated low voltage heat spreader (IHS). The IHS provides a common interface

intended to be compatible with many heatsink designs. Thermal specifications are based on the

temperature of the IHS top, referred to as the case temperature, or T

CASE

. Thermal solutions should

be designed to maintain the processor within T

CASE

specifications. For information on performing

CASE

measurements, refer to the Intel

Xeon

™

Processor Thermal Design Guidelines.

See Figure 34 for an exploded view of the processor package and thermal solution assembly.

Note: This is a graphical representation. For specifications, see each component’s respective

documentation listed in Section 1.3.

6.1 Thermal Specifications

To allow for the optimal operation and long-term reliability of Intel processor-based systems, the

system/processor thermal solution should be designed such that the processor remains between the

minimum and maximum case temperature (TC) specifications when operating at or below the

Figure 34. Processor with Thermal and Mechanical Components - Exploded View

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Lenovo 59P5107 Datasheet Page 89